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A look at the semiconductor industry evolution, the inflection points, and how packaging and interconnect technologies evolved to make chiplets a viable alternative to monolithic dies to keep Moore's law alive, CPU/GPU and networking industry's chiplet adaption and the future trends... ...
A detailed review of the various components inside a high-end router and how they contribute to overall power consumption. Article initially published on Linked here . Introduction The last few decades have seen exponential growth in the bandwidths of high-end routers and switches. As...
Current practices and future trends on buffers in networking chips. Article initially published on LinkedIn . Introduction This article explores the history and evolution of packet buffering in high...
Basic concepts of Forwarding Information Base (FIB), the longest prefix match (LPM) for IP forwarding, and how its implementation has evolved over time. The emphasis is on various hardware implementation choices and how they compare with each other in die area/power and performance. This is...
SiPh (Silicon Photonics) is no longer SciFi (Science Fiction). Let's see where is the industry today with co-packaged optics... Article initially published on LinkedIn . Introduction This article explains the basic concepts of optical...
The gap between processor and memory performance and density continued to increase - this is often referred to as the "Memory Wall". Article initially published on LinkedIn. Introduction: Von Neumann Bottleneck / Memory Wall All modern computers are built using...
Networking chips (also called network processors) started getting momentum in the mid-90s, with Juniper at the forefront of the revolution, when we figured out how to do the longest prefix match lookups in hardware! Introduction In this era of CPUs, GPUs, and AI inference chips (often...